Key Process Considerations for High-Frequency, High-Speed Hydrocarbon Resin PCB Manufacturing

Selecting an exceptional high-frequency material is only half the battle. The core challenge for every process engineer is how to fully unlock the material's inherent potential through optimized high-frequency PCB manufacturing processes, translating it into outstanding performance in the final product. While high-frequency, high-speed hydrocarbon resins offer excellent process adaptability, achieving optimal results still requires special attention to critical steps like lamination and drilling. Understanding and mastering these process fundamentals is essential for achieving high yield and high-performance production.

I. Storage and Pre-Treatment: Laying the Foundation
Despite the extremely low moisture absorption of high-performance hydrocarbon resins, any trace moisture should be treated as a potential risk prior to precision processing. Therefore, raw materials should be stored in a cool, dry, and light-protected environment. Prior to use, especially for materials stored for extended periods after opening, performing an appropriate pre-bake (typically 1-2 hours at 100-120°C) is highly recommended. This step thoroughly removes any adsorbed surface moisture, providing the optimal initial state for subsequent lamination. It effectively prevents potential issues like internal bubbles or delamination caused by rapid vaporization of trapped moisture during high-temperature processing.

II. Laminating Cycle: Perfect Fusion Through Precise Control
Laminating is the core process that gives life to multilayer board structures. For high-frequency, high-speed hydrocarbon resins, the optimization goal of the laminating cycle is to ensure complete resin flow, filling all circuit gaps and expelling internal air, while avoiding over-curing or thermal decomposition.
• Heating Rate: Avoid excessive speed. A gradual heating curve allows sufficient time for resin flow and wetting after reaching the melting point, particularly in areas with dense inner layer traces.
• Pressure Curve: Must precisely match the temperature curve and resin flow characteristics. Multi-stage pressurization is typically employed, applying full pressure during the resin's peak flow phase to ensure optimal filling and uniform board thickness.
• Holding Pressure Time and Temperature: Strict adherence to the material supplier's technical specifications is essential to achieve optimal resin cross-linking and curing. Insufficient curing leads to soft boards and reduced heat resistance; over-curing may cause brittleness, affecting subsequent processes.

III. Drilling Parameters: Details Determine Hole Wall Quality
Numerous signal vias in high-frequency circuits are critical for interlayer interconnections. A smooth, burr-free hole wall is essential for subsequent high-quality electroplating.
• Drill Selection: It is strongly recommended to use new or sharp specialized drills. While hydrocarbon resins are not as soft and prone to sticking as PTFE, their high cross-linking density still causes drill wear. Sharp tools enable cleaner cutting, reducing hole wall tearing and thermal effects.
• Drilling Parameters: Optimize rotational speed (RPM) and feed rate. Proper parameter combinations maximize efficiency while minimizing heat generated by drilling friction, preventing resin softening and “drill fouling.” Higher RPMs paired with moderate feed rates are typically recommended.

Mastering these critical aspects of high-frequency PCB manufacturing enables manufacturers to consistently translate the superior electrical properties of high-frequency, high-speed hydrocarbon resins into reliable, uniform end products. This capability allows them to stand out in competitive markets through exceptional quality and yield rates.