What is the peel strength of your hydrocarbon resin with copper foil?

Release time:

Through specialized interface bonding technology, we ensure excellent adhesion between the resin and copper foil.

Through specialized interfacial bonding technology, we ensure exceptional adhesion between the resin and copper foil. The peel strength typically exceeds 8 lb/in, fully meeting the mechanical and thermal stress requirements of high-frequency circuit boards during multiple lead-free reflow soldering cycles. This effectively prevents board cracking and delamination.

FAQ

Do you support customized development to meet the unique requirements of our specific projects?

Our customization capabilities span the following dimensions:

How do you ensure high consistency in product performance across batches?

We ensure the high consistency of hydrocarbon resin product performance through three key aspects.

What key process parameters should be considered when using your hydrocarbon resin for PCB processing?

Processing parameters to note when using our hydrocarbon resin for PCB materials.

What performance advantages does your hydrocarbon resin offer in the millimeter wave band?

Extremely low insertion loss, outstanding phase stability, and reduced signal delay.

What specific products and fields are your hydrocarbon resins primarily applied to?

Our hydrocarbon resins are primarily used in 5G communications, automotive electronics, data centers, and high-end consumer electronics.

Do you offer resin forms suitable for different lamination processes (such as pressing and coating)?