What key process parameters should be considered when using your hydrocarbon resin for PCB processing?

Release time:

Processing parameters to note when using our hydrocarbon resin for PCB materials.

Our material offers excellent process adaptability, but for optimal results, we recommend focusing on:
Lamination cycle: Optimized heating rates and pressure curves are required to ensure proper resin flow and void filling while preventing excessive volatilization.
Drilling Parameters: Use sharp drill bits and appropriate feed rates to achieve clean hole walls, laying the foundation for subsequent high-quality plating.
Storage Conditions: Store raw materials in a cool, dry environment and perform adequate pre-baking before use to remove any absorbed trace moisture.

FAQ

Do you support customized development to meet the unique requirements of our specific projects?

Our customization capabilities span the following dimensions:

How do you ensure high consistency in product performance across batches?

We ensure the high consistency of hydrocarbon resin product performance through three key aspects.

What key process parameters should be considered when using your hydrocarbon resin for PCB processing?

Processing parameters to note when using our hydrocarbon resin for PCB materials.

What performance advantages does your hydrocarbon resin offer in the millimeter wave band?

Extremely low insertion loss, outstanding phase stability, and reduced signal delay.

What specific products and fields are your hydrocarbon resins primarily applied to?

Our hydrocarbon resins are primarily used in 5G communications, automotive electronics, data centers, and high-end consumer electronics.

Do you offer resin forms suitable for different lamination processes (such as pressing and coating)?