Do you support customized development to meet the unique requirements of our specific projects?

Absolutely! Customized development is a key component of our core competitiveness.
Our customization capabilities span the following areas:
1. Electrical Property Customization:
Precise Dielectric Constant Tuning: We can finely adjust the resin's dielectric constant within a specified range (e.g., Dk from 2.4 to 3.2) to match your specific requirements for impedance control and signal transmission speed.
Optimized Loss Factor: For loss limits across different frequency bands, we employ advanced synthesis and purification processes to deliver solutions with lower loss characteristics.
2. Thermomechanical Performance Customization:
Adjusting Glass Transition Temperature: Based on your PCB assembly and operating environment temperatures, we can modify the resin's Tg to meet higher thermal resistance requirements (e.g., elevated to >200°C) or accommodate specific manufacturing processes.
Controlling Thermal Expansion Coefficient: We optimize CTE for better matching with copper foil, ceramic fillers, etc., enhancing multilayer board reliability while reducing warpage and delamination risks.
3. Process & Form Customization:
Providing Suitable Physical Forms: Based on your lamination process, we offer resin products in sheet, powder, or other forms to accommodate pressing, coating, and other manufacturing steps.
Compatibility Adjustment: We can modify resin compatibility with other systems (e.g., specific curing agents, fillers, or reinforcements) to ensure optimal performance within your composite formulations.
4. Functional Modification:
While preserving core low-loss properties, we can introduce specific functional groups to impart additional material characteristics—such as enhanced bonding strength or improved thermal conductivity.