How heat-resistant are hydrocarbon resins?

Our high-frequency, high-speed pure hydrocarbon resin materials exhibit exceptional heat resistance, primarily due to their stable saturated hydrocarbon molecular structure and deep hydrogenation process. This heat resistance manifests in two key aspects: resistance to deformation at high temperatures and resistance to thermal decomposition. Specifically:
High Glass Transition Temperature – Ensuring Structural Stability
Our materials typically feature a glass transition temperature exceeding 180°C, with certain custom grades reaching over 200°C.
What does this mean? Below the Tg temperature, the material maintains a rigid “glass-like” structure; it only begins to soften when temperatures exceed the Tg. This means that during conventional lead-free reflow soldering in PCB assembly (with peak temperatures around 260°C), our substrate material retains sufficient rigidity to effectively prevent defects such as delamination and warping, ensuring the reliability of the final product.
High Thermal Decomposition Temperature – Ensuring Chemical Stability
Our material exhibits a thermal decomposition temperature exceeding 400°C (as measured by 5% weight loss in TGA thermal gravimetric analysis).
What does this mean? It ensures that during brief high-temperature exposure (e.g., during soldering), the material's molecular chains do not break or decompose, thereby preventing the release of volatile substances that could cause circuit failure. This provides a generous safety margin within the manufacturing process.